KEMET Patent on Substrate With Embedded Capacitor

June 25, 2013 Ė FOR IMMEDIATE RELEASE

PERKINS is pleased to announce the recent issuance of a patent on a substrate with embedded capacitor to Greenville S.C.-based client Kemet Electronics Corporation

United States Patent 

8,470,680

Prymak ,   et al. 

June 25, 2013 

Kemet Electronics Corporation

 


Substrate with embedded patterned capacitance

Abstract

A process for forming a laminate with capacitance and the laminate formed thereby. The process includes the steps of providing a substrate and laminating a conductive foil on the substrate wherein the foil has a dielectric. A conductive layer is formed on the dielectric. The conductive foil is treated to electrically isolate a region of conductive foil containing the conductive layer from additional conductive foil. A cathodic conductive couple is made between the conductive layer and a cathode trace and an anodic conductive couple is made between the conductive foil and an anode trace.

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